Name:
IEC/TR 61760-3-1 Ed. 1.0 en:2022 PDF
Published Date:
06/01/2022
Status:
Active
Publisher:
International Electrotechnical Commission - Technical Report
This Part of IEC 61760 supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
| Edition : | 1.0 |
| File Size : | 1 file , 2.2 MB |
| ISBN(s) : | 9782832239285 |
| Note : | This product is unavailable in Russia, Belarus, Ukraine, Canada |
| Number of Pages : | 30 |
| Published : | 06/01/2022 |
